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High Current

Smart Solutions einen optimalen Einsatz für Hochstrom-Applikationen

Leiterplatten, die höhere beziehungsweise sehr hohe Ströme übertragen müssen, werden bei Unimicron Germany bereits seit vielen Jahren in Dickkupfer-Technik hergestellt. Aber auch, wenn nur partiell auf einer herkömmlichen Platine hohe Ströme fließen sollen, bieten wir fortschrittliche Lösungsansätze.

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Thick Copper Technology - HiCU PCB

Thick Copper PCBs are an optimal solution used for the voltage distribution and the management of high current.

Applications:
-   Realisation of power and signal on one board
-   Relay and fuse boxes, DC/DC converter
-   Inverters for renewable energy sources


Advantages:
-  Cost reduction
-  Easy assembly
-  Weight reduction

Thick Copper Profile Technology - HiCu Profile PCB

In HiCu Profile Technology massive copper elements, round and angular, are inserted in the inner cores of multilayer PCBs and then laminated into the PCB.

Applications:
-  Power electronics
-  Current carrying capacity up to 1,000 A
-  Power and logic combined on one board

Advantages:

-  Excellent heat dissipation
-  Combination of logic and power
-  Weight savings and reduction of thickness of PCB

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Metal Inlay Technology - Metal Inlay PCB

In Metal Inlay Technology a massive copper element (inlay) is pressed into the PCB and serves to dissipate the heat of an electronic component through the board.

Applications:
-  Electro mobility and automotive
-  Industrial electronics
-  Lightning technology

Advantages:

-  Optimal heat dissipation
-  Wide scope to choose the geometry of the inlays
-  Very good planarity of the inlay to the reference layer

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Partial Thick Copper Technology - Wirelaid®

In Wirelaid Technology copper wires are applied to the treatment side of a copper foil by micro resistance welding. It can be an cost efficiency alternative to thick copper technology.

Applications:
-  Power electronics
-  High current applications up to 100 A
-  Semiflex version possible

Advantages:

-  Combination of power and logic on one board
-  Optimal heat dissipation
-  Cost reduction

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