.png)
Heatmanagement
High temperatures act on printed circuit boards not only when they are exposed to high ambient temperature, for example on an engine block, in the exhaust gas train, or in the brake system of a vehicle. The increasing compaction of performance in electronics leads to rising temperatures developing on the circuit board. This as a result of heat loss from high-performance components or inherent warming of conductors due to the transmission of high currents. In line with maximum assembly reliability, the heat generated must be dissipated in such a way that critical temperatures are not reached or exceeded. This is where modern heat management solutions that distribute high temperatures uniformly across an area and dissipate them at the surface or at the housing can help to keep heat away from sensitive components.
Unimicron Germany offers a large number of solution concepts for this
Thick Copper Technology - HiCu PCB
Thick Copper PCBs are an optimal solution used for the voltage distribution and the management of high current.
Applications:
- Realisation of power and signal on one board
- Relay and fuse boxes, DC/DC converter
- Inverters for renewable energy sources
Advantages:
- Cost reduction
- Easy assembly
- Weight reduction
Thick Copper Profile Technology - HiCu Profile PCB
In HiCu Profile Technology massive copper elements, round and angular, are inserted in the inner cores of multilayer PCBs and then laminated into the PCB.
Applications:
- Power electronics
- Current carrying capacity up to 1,000 A
- Power and logic combined on one board
Advantages:
- Excellent heat dissipation
- Combination of logic and power
- Weight savings and reduction of thickness of PCB
Metall-Inlay-Technology - Metal Inlay PCB
In Metal Inlay Technology a massive copper element (inlay) is pressed into the PCB and serves to dissipate the heat of an electronic component through the board.
Applications:
- Electro mobility and automotive
- Industrial electronics
- Lightning technology
Advantages:
- Optimal heat dissipation
- Wide scope to choose the geometry of the inlays
- Very good planarity of the inlay to the reference layer
IMS and Heatsink Technology -
Metal Plate PCB
IMS as well as heatsink technology are extremely efficient ways of dissipating heat from an electronic assembly. In case using heatsinks the bonded metal plate can be part of the housing concept.
Applications:
- Electro mobility and automotive
- Industrial electronics
- Lightning technology
Advantages:
- Optimal heat dissipation
- High reliability
- Combinable with all other technologies
Partial Thick Copper Technology - Wirelaid®
In Wirelaid Technology copper wires are applied to the treatment side of a copper foil by micro resistance welding. It can be an cost efficiency alternative to thick copper technology.
Applications:
- Power electronics
- High current applications up to 100 A
- Semiflex version possible
Advantages:
- Combination of power and logic on one board
- Optimal heat dissipation
- Cost reduction